Facile and Green Synthesis of Graphene-Based Conductive Adhesives via Liquid Exfoliation Process
نویسندگان
چکیده
منابع مشابه
Facile and green synthesis of CuO nanoparticles and electrocatalytic activity of CuO nanoparticles/conductive polymer composite film
In this work, CuO nanoparticles (CuO NPs) was prepared by a simple and green method using Rosmarinus officinalis extract containing phenolic constituents as both the chelating and the stabilizing agents. CuO nanoparticles/polyorthoaminophenol composite (CuO NPs/POAP) as electro-active electrodes for electrocatalytic oxidation of methanol with good uniformity are prepared by electropolymerizatio...
متن کاملFacile and green synthesis of CuO nanoparticles and electrocatalytic activity of CuO nanoparticles/conductive polymer composite film
In this work, CuO nanoparticles (CuO NPs) was prepared by a simple and green method using Rosmarinus officinalis extract containing phenolic constituents as both the chelating and the stabilizing agents. CuO nanoparticles/polyorthoaminophenol composite (CuO NPs/POAP) as electro-active electrodes for electrocatalytic oxidation of methanol with good uniformity are prepared by electropolymerizatio...
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Commercialization of graphene based applications inevitably requires cost effective mass production. From the early days of research on graphene, direct liquid phase exfoliation (LPE) of graphite has been considered as the most promising strategy to produce high-quality mono or few-layer graphene sheets in solvent dispersion forms. Substantial success has been achieved thus far in the LPE of gr...
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Superparamagnetic few-layer graphene nanocomposites (FLG- NCs) can be used for many technological applications, such as solar cells, batteries, touch panels and supercapacitors. In this work, we applied electrochemical exfoliation method as a simple, one step and economical technique to fabricate FLG- NCs. The fabricated Superparamagnetic FLG- NCs were characterized by X-ray diffraction (XRD), ...
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S ince the advent of through-hole printed wiring boards in the 1950s, surface-mount technology has advanced through chip capacitors and resistors to high-density multilayer hybrids and printed circuit boards. Throughout this 40-year span, solder paste has been the accepted technology for component attach.' The present trend toward fine-pitch resolution ( t0.020") and multilayer constructions of...
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ژورنال
عنوان ژورنال: Nanomaterials
سال: 2018
ISSN: 2079-4991
DOI: 10.3390/nano9010038